With the continuous development and maturity of the LED industry, as an important link in the LED industry chain, LED packaging is considered to be facing new challenges and opportunities. Then, with the change of market demand, the development of LED chip preparation technology and LED packaging technology, where is the development space of LED packaging in the future?

In terms of packaging design, the design of in-line LED has been relatively mature. At present, it can be further improved in terms of attenuation life, optical matching, failure rate and so on. The design of SMD LED, especially the top light-emitting SMD, is in continuous development. The packaging support size, packaging structure design, material selection, optical design and heat dissipation design are constantly innovated, which has broad technical potential. The design of power LED is a Xintiandi. As the manufacturing of power type large-size chips is still in development, the structure, optics, materials and parameter design of power LED are also in development, and new designs continue to appear.

From the technical level, high-power products move towards EMC’s integrated chip packaging, replacing low-power cob with EMC products of 500-1500lm level and integrated chip, or replacing multiple applications of 3030 level. The possibility of EMC packaging more than 20W integrated chips will not be ruled out in the future