High power LED packaging mainly involves light, heat, electricity, structure and technology. These factors are not only independent of each other, but also affect each other. Among them, light is the purpose of LED packaging, heat is the key, electricity, structure and technology are the means, and performance is the specific embodiment of the packaging level. In terms of process compatibility and reducing production cost, LED packaging design should be carried out simultaneously with chip design, that is, the packaging structure and process should be considered in chip design. Otherwise, after the chip manufacturing is completed, the chip structure may be adjusted due to the need of packaging, which prolongs the product R & D cycle and process cost, sometimes even impossible.

Specifically, the key technologies of high-power LED packaging include:

1、 Low thermal resistance packaging process

2、 Packaging structure and technology of high light absorption

3、 Array packaging and system integration technology

4、 Packaging mass production technology

5、 Packaging reliability test and evaluation