Developers can improve the efficiency and service life of led through effective heat dissipation management. Careful selection of heat dissipation materials and application methods is very important.

We need to consider an important factor in product selection – the application of heat dissipation management materials. No matter the packaging compound or the interface material, any gap in the heat conducting medium will lead to the reduction of heat dissipation rate.

For thermal conductive packaging resin, the key to success is to ensure that the resin can flow around the unit, including entering any small gap. This uniform flow helps to remove any air gaps and ensures that no heat is generated throughout the unit. In order to achieve this application, the resin needs correct thermal conductivity and viscosity. Generally, as the thermal conductivity of the resin increases, the viscosity also increases.

For interface materials, the viscosity of the product or the possible minimum thickness during application have a great influence on the thermal resistance. Therefore, compared with products with low bulk thermal conductivity and low viscosity, compounds with high thermal conductivity and high viscosity can not diffuse evenly to the surface, but have higher heat resistance and lower heat dissipation efficiency. In order to maximize heat transfer efficiency, users need to solve the problems of accumulated thermal conductivity, contact resistance, application thickness and process.

With the rapid development of electronic industry, more specifically, in the application of LED, material technology must also meet higher and higher heat dissipation requirements. This technology is now also transferred to packaging compounds to provide higher filler loads for products, thereby improving thermal conductivity and liquidity.