For LED light-emitting chips, using the same technology, the higher the power of a single LED, the lower the light efficiency, but it can reduce the number of lamps used, which is conducive to saving costs; The smaller the power of a single LED, the higher the luminous efficiency. However, the number of LEDs required in each lamp increases, the size of the lamp body increases, and the design difficulty of the optical lens increases, which will have a negative impact on the light distribution curve. Based on comprehensive factors, LED with single rated working current of 350mA and power of 1W is usually used.

At the same time, packaging technology is also an important parameter that affects the light efficiency of LED chips. The thermal resistance parameter of LED light source directly reflects the packaging technology level. The better the heat dissipation technology, the lower the thermal resistance, the smaller the light attenuation, the higher the brightness and the longer the life of the lamp.

As far as the current technological achievements are concerned, if the luminous flux of LED light source wants to reach the requirements of thousands or even tens of thousands of lumens, a single LED chip cannot achieve it. In order to meet the demand of lighting brightness, the light source of multiple LED chips is combined in one lamp to meet the high brightness lighting. The goal of high brightness can be achieved by improving the luminous efficiency of LED, adopting high luminous efficiency packaging and high current through multi-chip large-scale.

There are two main ways of heat dissipation for LED chips, namely heat conduction and heat convection. The heat dissipation structure of LED lamps includes base heat sink and radiator. The soaking plate can realize ultra-high heat flux heat transfer and solve the heat dissipation problem of high-power LED. The soaking plate is a vacuum cavity with micro-structure on the inner wall. When the heat is transferred from the heat source to the evaporation area, the working medium in the cavity will produce the phenomenon of liquid phase gasification in the low vacuum environment. At this time, the medium absorbs heat and the volume expands rapidly, and the gas phase medium will soon fill the entire cavity. When the gas-phase medium contacts a relatively cold area, condensation will occur, releasing the heat accumulated during evaporation, and the condensed liquid medium will return to the evaporation heat source from the microstructure.

The commonly used high-power methods of LED chips are: chip enlargement, improvement of luminous efficiency, packaging with high light efficiency, and large current. Although the amount of current luminescence will increase proportionally, the amount of heat will also increase. The use of high thermal conductivity ceramic or metal resin packaging structure can solve the heat dissipation problem and strengthen the original electrical, optical and thermal characteristics. In order to improve the power of LED lamps, the working current of LED chips can be increased. The direct way to increase the working current is to increase the size of LED chips. However, due to the increase of the working current, heat dissipation has become a crucial problem. The improvement of the packaging method of LED chips can solve the heat dissipation problem.