For LED light-emitting chips, using the same technology, the higher the power of a single LED, the lower the light efficiency. However, it can reduce the number of lamps used, which is beneficial for cost savings; The smaller the power of a single LED, the higher the light efficiency. However, as the number of LEDs required in each lamp increases, the size of the lamp body increases, and the design difficulty of the optical lens increases, which can have adverse effects on the light distribution curve. Based on comprehensive factors, a single LED with a rated working current of 350mA and a power of 1W is usually used.

At the same time, packaging technology is also an important parameter that affects the light efficiency of LED chips, and the thermal resistance parameters of LED light sources directly reflect the level of packaging technology. The better the heat dissipation technology, the lower the thermal resistance, the smaller the light attenuation, the higher the brightness of the lamp, and the longer its lifespan.

In terms of current technological achievements, it is impossible for a single LED chip to achieve the required luminous flux of thousands or even tens of thousands of lumens for LED light sources. To meet the demand for full illumination brightness, multiple LED chip light sources have been combined in one lamp to meet the high brightness lighting needs. By scaling up multiple chips, improving LED luminous efficiency, adopting high light efficiency packaging, and high current conversion, the goal of high brightness can be achieved.

There are two main cooling methods for LED chips, namely thermal conduction and thermal convection. The heat dissipation structure of LED lighting fixtures includes a base heat sink and a heat sink. The soaking plate can achieve ultra-high heat flux density heat transfer and solve the heat dissipation problem of high-power LEDs. The soaking plate is a vacuum chamber with a microstructure on its inner wall. When heat is transferred from the heat source to the evaporation zone, the working medium inside the chamber undergoes liquid-phase gasification in a low vacuum environment. At this time, the medium absorbs heat and rapidly expands in volume, and the gas-phase medium quickly fills the entire chamber. When the gas-phase medium comes into contact with a relatively cold area, condensation occurs, releasing the heat accumulated during evaporation. The condensed liquid phase medium will return from the microstructure to the evaporation heat source.

The commonly used high-power methods for LED chips are: chip scaling, improving luminous efficiency, using high light efficiency packaging, and high current conversion. Although the amount of current emitted by this method will increase proportionally, the amount of heat generated will also increase accordingly. Switching to a high thermal conductivity ceramic or metal resin packaging structure can solve the heat dissipation problem and enhance the original electrical, optical, and thermal characteristics. To increase the power of LED lighting fixtures, the working current of the LED chip can be increased. The direct method to increase the working current is to increase the size of the LED chip. However, due to the increase in working current, heat dissipation has become a crucial issue, and improvements in the packaging of LED chips can solve the heat dissipation problem.